FORI PASSANTI
Through-Hole Technology – Sealed Linear Channel LCP
In through-hole liquid trays, the internal fluid circuits are obtained by direct extrusion of profiles or by deep drilling on solid metal alloy plates. The circuit architecture—whether standard or completely customized—is defined by selectively occluding the channels with sealing plugs specifically positioned at critical internal and external points, thus generating the desired flow paths within the volume of the tray.
Application of Through-Hole Technology
Through-hole technology represents the optimal solution for applications with low thermal requirements, where production efficiency, cost-effectiveness and simplicity of manufacture are the main decision factors.
No geometric constraints in drilling: hole diameter and depth are completely configurable according to project specifications.
Compatibility with all aluminum alloys and other metals commonly used in cooling systems.
Maximum geometric flexibility for the creation of:
Simplified LCPs
Hybrid air/liquid heat sinks
Multi-input/output thermal blocks
Integration with flanges and special fittings
Main Technical Features
Full volumetric configurability: no limit on the dimensions along the X, Y, Z axes of the component.
Variable hole length: defined based on the diameter of the hole and the structure of the material.
Use of watertight caps in strategic positions, both lateral and intermediate, for the functional definition of the internal channels.
Input/output connections can be made both on-axis and off-axis, on any face of the plate.
Operational Benefits
Reduced manufacturing costs compared to other liquid cooling technologies.
Rapid prototyping and production times.
High geometric customization, even for small batches or specific applications.
Ideal technology for environments where the required thermal efficiency is limited, but mechanical robustness and structural simplicity are priorities.